Can you recall the definition and read it off directly?
Recall Solution L1.1
WHAT: We check the reading convention. WHY: the bit is defined by whether the cell conducts at read voltage, not by "is there charge."
Charge on gate ⇒ high Vth ⇒ does NOT conduct ⇒ reads as 0.
An empty (erased) gate ⇒ low Vth ⇒ conducts ⇒ reads 1.
Answer: 0.
Recall Solution L1.2
Parallel, per-cell contact → NOR (each cell independently reachable ⇒ fast random read).
Read: byte/page (fine). Program: page. Erase: block (coarse).
The one-way rule: you can clear bits 1→0 per page, but restoring 0→1 needs a whole-block erase. Never bit-granular. This asymmetry uses Fowler–Nordheim tunnelling.
Plug the numbers into the formulas from the parent note.
Recall Solution L2.1
WHY log2: each distinct level is one symbol; the number of bits needed to name L symbols is log2L (because 2b symbols need b bits).
b=log216=4 bits.Answer: 4 bits (that's the "Q" — quad — in QLC).
WHAT: tightest packing = one line-width of active + one line-width of space in each direction.
ANAND=x(2F)×y(2F)=4F2.
NOR needs an extra contact + isolation per cell, inflating it to ∼10F2.
Answer: 4F2. See the figure below.
WHY a ratio: cells-per-area is inversely proportional to area-per-cell, so divide the areas.
ANANDANOR=4F210F2=2.5.Answer: 2.5× more NAND cells in the same silicon.
Recall Solution L3.2
WHY multiply: two independent multipliers — more cells and more bits each.
2.5(cells)×3(bits/cell)=7.5×.Answer: ≈7.5× more bits per area. This is whySSDs use TLC/QLC NAND, not NOR.
Recall Solution L3.3
Order (most → least): SLC > MLC > TLC > QLC.
Why: more bits/cell packs more Vth levels into the same voltage window, so each level's margin shrinks. Oxide wear from Fowler–Nordheim tunnelling then pushes cells across those thin margins sooner — fewer usable P/E cycles. Tighter margins also demand heavier error correction. See Wear leveling and write amplification.
Chain several rules together into a realistic scenario.
Recall Solution L4.1
WHY the whole block: you cannot restore any 0→1 bit without erasing its entire block — erase is block-granular. So the controller reads the 256 KB block into RAM, edits the byte, erases the block, rewrites all 256 KB.
Physical work: 256 KB=256×1024=262144 bytes written.
Write amplification=1 byte logical262144 bytes physical=262144×.Answer: 262144 bytes moved; amplification =262144×. This intrinsic cost is exactly why the FTL and Wear leveling and write amplification exist.
Recall Solution L4.2
WHY it's cheaper: by pointing the logical address at a new physical page it dodges the block erase entirely — it only pays for one page.
Physical write: 4 KB=4×1024=4096 bytes.
Amplification=14096=4096×.Answer: 4096 bytes; amplification =4096×. Still huge, but 64× better than the naive block rewrite (262144/4096=64). The erase cost was deferred to background garbage collection.
Design-level judgement: pick the right technology and justify with numbers.
Recall Solution L5.1
(a) Boot firmware → NOR. Decisive reason: execute-in-place (XIP) needs true random/byte reads so the CPU fetches instructions directly. NOR's parallel per-cell wiring gives fast random reads; NAND must load a whole page first, so it can't XIP.
(b) 128 GB user storage → NAND (TLC/QLC). Decisive reason: cost per bit. NAND's ∼4F2 series packing plus multi-bit cells give ∼7.5× the bits/area of SLC NOR — the only economical way to reach 128 GB. Its slower random reads don't matter for bulk photo/app data. Fits the Memory hierarchy role of cheap bulk non-volatile store.
Recall Solution L5.2
WHY multiply: perfect wear leveling means every byte of capacity can be rewritten once per P/E cycle, so total writes = capacity × cycles.
Capacity =256 GB=256×109=2.56×1011 bytes (using decimal GB).
Total writes=2.56×1011×1000=2.56×1014 bytes=256 TB.Answer: 2.56×1014 bytes =256 TB (ideal).Why real drives fall short: write amplification is >1 (the L4 problem — a small logical write drags a bigger physical write), and wear leveling is imperfect, so the usable TBW is a fraction of this ceiling.