4.1.2 · D4Memory Technologies

Exercises — SRAM read - write operations

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Before we begin, one shared picture we will reuse in almost every problem: the voltage divider on node Q. During a read or a write, the internal node is being tugged toward two different voltages by two "on" transistors at once. We model each transistor as a plain resistor and ask: where does the node settle?

Figure — SRAM read - write operations

The figure above is our master template. Read it like this: the black dot in the middle is node . The green line is the pull-down resistor tying down to ground (0 V). The orange line is the access resistor tying to the bit-line . The dashed red line is the pull-up resistor tying to — this branch only matters during a write. In every problem below we just decide which two of these three resistors are active and plug them into the one divider equation.


Level 1 — Recognition

Recall Solution
  • M1, M3 — NMOS pull-downs (one per inverter). They tie the internal node to ground when that node should be a logic 0.
  • M2, M4 — PMOS pull-ups (one per inverter). They tie the node to for a logic 1.
  • M1+M2 form one inverter, M3+M4 the other; cross-coupling them makes the bistable latch.
  • M5, M6 — NMOS access (pass) transistors, gated by the word-line WL, connecting and .

Why bistable — the butterfly picture. Each inverter's output-vs-input curve is an S-shape. Plotting one inverter's curve and the other's mirrored on the same axes gives a butterfly: they cross at exactly two outer points (the two stable states, or ) and one middle point (unstable). The largest square you can fit into either wing is the Static Noise Margin (SNM) — how much accidental voltage the node can absorb before the latch flips. See the figure below.

Figure — SRAM read - write operations
Recall Solution

Both bit-lines are driven high to , then floated (left disconnected so they hold their charge). The cell then pulls one of them slightly down. We charge high because the cell's NMOS pull-down is good at sinking current (pulling down) but the cell cannot easily source current to push a line above .


Level 2 — Application

Recall Solution

Node is at ground, connected through M5 to (sitting at ). Current flows from into ground → droops. Node is at and cannot pull below , so stays high. How the sense amp turns that droop into a logic value: it is a small cross-coupled amplifier that watches the difference . Whichever bit-line is lower gets driven all the way to 0, the higher one all the way to — it amplifies a tiny (tens of mV) into a full logic level. Here drooped, so the amp latches . By the convention "value of node = value on ", reads a 0.

Recall Solution

Use the divider with through , through : Since , node never climbs to the other inverter's trip point → stable, no read upset. ✔ Cell ratio ; the pull-down is 4× stronger — very safe.

Recall Solution

, so the pull-down dominates during read. ✔


Level 3 — Analysis

Recall Solution

Now the low side is the bit-line and the high side is the pull-up ( via ; via ): We need to trip the far inverter. write succeeds. ✔ Intuition: the access transistor (k) is stronger than the pull-up (k), so it wins the tug-of-war and drags down. Here — writable.

Recall Solution

never crosses the trip point → write FAILS. ✘ The over-strong PMOS holds up. Here (access weaker than pull-up), consistent with failure. Fix: weaken the pull-up (smaller → larger ) or widen the access transistor (smaller ) so access beats pull-up.

Recall Solution

Set (the tipping edge) and solve: So writes. At exactly the access equals the pull-up (, right on the trip point — marginal). To have margin, make noticeably smaller than . ✔

Figure — SRAM read - write operations

Level 4 — Synthesis

Recall Solution

Strategy from the mnemonic "READ the Pull-Down, WRITE past the Pull-Up": make the pull-down strong and keep the pull-up at minimum width (weakest allowed), and widen the access moderately. Choose (strong), (reference = weakest allowed), . Resistances: , , .

Read check ( between via and gnd via ): Write check ( between via and via ): Both pass. (read-safe); (write-safe). ✔ Every multiplier is , so the design is manufacturable. ✔

Recall Solution

Read: V right on the tipping point → read upset risk. ✘ (zero margin, per the L3 "marginal" note) Write: V → write got easier. ✔ So a stronger access helps write but hurts read — exactly the tension. The safe move is to keep access moderate and instead ensure by strengthening the pull-down.


Level 5 — Mastery

Recall Solution

Start from the read divider: Let . Divide numerator and denominator by : Since , we need . Check L2.2: , → require . L2.2 had → safe, consistent with the V we found. ✔

Recall Solution

Write divider: Let . Then The combined window (using and ): Read pushes access to be weak relative to the pull-down; write pushes access to be strong relative to the pull-up. The design lives in the overlap — and shrinking (or drifting ) narrows it, which is why low-voltage SRAM is hard.

Recall Solution
  • Read floor: . Need .
  • Write ceiling: . Need .
  • L4.1 design: ✔ and ✔. Inside both. ✔

Recall

Read-stability condition on the resistance ratio?
, i.e. cell ratio (pull-down stronger than access).
Write-success condition on the resistance ratio?
, i.e. (access stronger than the pull-up).
Why does widening only the access transistor threaten the read?
It lowers , raising the read-divider voltage toward the trip point → read upset; helps write but hurts read.
In these SRAM margin formulas, what does mean?
The inverter's switching/trip point, not a single MOSFET's threshold voltage.
What does landing exactly at mean physically?
Zero noise margin — the SNM square shrinks to a point, so any noise or transistor-variation flips the cell; never a safe design.