What: We match a description to a named model.
Why: Recognition first — you must own the vocabulary before you reason with it.
This is the electron-sea (Drude/Lorentz) model. The roaming particles are the delocalised valence electrons. The positive kernels are the cations (atoms that gave up those valence electrons). See Giant structures / lattices for the lattice geometry.
Recall Solution
What: Sort three gaps into conductor / semiconductor / insulator.
Why: The size of the forbidden gap alone decides the electrical class (see Electrical conductivity).
(a) Eg=0 → conductor (metal): filled and empty states touch, electrons move with no climb.
(b) Eg=1.1 eV → semiconductor (this is silicon): small enough that heat promotes some carriers.
(c) Eg=5.5 eV → insulator (this is diamond): the gap is a wall almost nothing crosses.
Step 1 — count donated electrons. Na is [Ne]3s¹ → 1 e⁻; Mg is [Ne]3s² → 2 e⁻; Al is [Ne]3s²3p¹ → 3 e⁻. Why: more electrons = more glue.
Step 2 — compare cation size. Across the period nuclear charge rises and radius shrinks: Na⁺ > Mg²⁺ > Al³⁺. Why: stronger pull from the nucleus contracts the ion (Ionization energy & atomic radius).
Step 3 — combine both knobs. Both effects push the same way: strength Na < Mg < Al.
Predicted m.p. order: Na < Mg < Al. (Real data: 98 °C, 650 °C, 660 °C — confirms it.)
Recall Solution
What: Take a ratio of the two Boltzmann factors.
Why the ratio, not each alone? The unknown proportionality constant cancels in a ratio, so we can answer cleanly.
ndianSi=e−Egdia/(2kBT)e−EgSi/(2kBT)=e−(EgSi−Egdia)/(2kBT)=e(5.5−1.1)/(2×0.02585)
The exponent is 4.4/0.0517=85.1, so the ratio is e85.1≈9×1036.
What it means: silicon has astronomically more carriers than diamond at the same T — that single exponential is why one is a useful semiconductor and the other an insulator (Semiconductors & doping).
Step 1 — identify what's the same. Both are metals; both use an electron sea. True but incomplete.
Step 2 — find the hidden extra bonding. Na donates 1 s-electron. Fe is [Ar]3d⁶4s²; its partially filled 3d orbitals also overlap and delocalise (Transition metals & d-orbitals), so Fe pours ~8 electrons into the sea, not 1.
Step 3 — apply the strength knob. Vastly more sea electrons + a small, highly-charged kernel → far stronger glue.
Conclusion: Fe ≫ Na in bond strength → Fe melts far hotter (Fe ≈ 1538 °C vs Na ≈ 98 °C). The flaw was treating "metal" as one uniform mechanism; d-orbital participation changes everything.
Recall Solution
Step 1 — the naive worry. A full band has no empty states, so on its own it cannot conduct.
Step 2 — the resolution: band overlap. Mg's filled 3s band overlaps the empty 3p band in energy. Look at Figure s01: the two shaded bands share an energy range instead of leaving a gap.
Step 3 — the consequence. Because they overlap, there are empty states (from 3p) sitting at the same energy as the topmost filled ones — so electrons can accelerate. Eg is effectively 0.
Takeaway: "full band" ≠ "insulator". Only full band + a gap above it insulates.
Step 1 — write the ratio. Same material, two temperatures:
n(300)n(400)=exp[−2kBEg(4001−3001)].Why a ratio again: the proportionality constant cancels.
Step 2 — the temperature bracket.4001−3001=0.0025−0.003333=−0.0008333K−1. It is negative, so the minus sign flips the exponent positive — carriers rise with heat, as expected for a semiconductor.
Step 3 — plug in.2kBEg=2×8.617×10−50.7=4062K. Exponent =−4062×(−0.0008333)=3.385.
Result: factor =e3.385≈29.5. Heating 100 K multiplies carriers ~30-fold. Contrast this with a metal, whose conductivity drops on heating — see the trap below.
Recall Solution
Step 1 — form the indexS=radiuselectrons×100 (the ×100 just gives friendly numbers).
Step 2 — compute.
Na: 1/102×100=0.98
Mg: 2/72×100=2.78
Al: 3/54×100=5.56Step 3 — rank.SAl>SMg>SNa, matching the melting-point order Na < Mg < Al. Both knobs (more electrons and smaller radius) reinforce each other down this list.
X's conductivity falls with heat → this is the metal / electron-sea fingerprint (electron–phonon scattering dominates; no gap to open). X is a conductor.
Y's conductivity rises steeply with heat → carriers are being unlocked across a gap → Y is an intrinsic semiconductor (band picture, Semiconductors & doping).
Part (b) — invert the carrier law to get Eg. Using n(300)n(600)=exp[−2kBEg(6001−3001)]=1000:
Temperature bracket: 6001−3001=0.0016667−0.0033333=−0.0016667K−1.
Take logs: 6.908=−2kBEg×(−0.0016667)=2kBEg×0.0016667.
So 2kBEg=0.00166676.908=4145K.
Then Eg=4145×2×8.617×10−5=0.714eV.
Result:Eg≈0.71 eV — a small-gap semiconductor, consistent with the strong thermal response. The opposite signs of the two trends, not their magnitudes, were the key clue.
Recall Solution
Step 1 — grant the true part. Both do involve electrostatic attraction between positive and negative charge. Fair.
Step 2 — locate the decisive difference: localisation. In Ionic bonding electrons are transferred and pinned onto specific anions at fixed lattice sites — the bonding is directional. In a metal the electrons are delocalised and shared by every cation.
Step 3 — a property that separates them.
Mechanical: slide a layer in an ionic crystal → like-charges align → repulsion → it shatters (brittle). Slide a layer in a metal → the directionless electron sea re-glues → it bends (malleable). One property, opposite outcome.
Electrical: ionic solids do not conduct when solid (charges fixed); metals do (electrons roam). See Figure s02.
Conclusion: shared electrostatics ≠ same bond. Delocalisation is the dividing line, and it shows up plainly as malleability and conductivity.