False. A full band has, for every electron drifting right, one drifting left → the currents cancel to zero. You need empty states to accelerate into, and at T=0 nothing is promoted across the 0.5eV gap, so there are none. No current.
What: evaluate the exponent, then convert.
2kTEg=2×0.025851.12=0.05171.12=21.66Why: the carrier fraction is e−21.66.
Convert: e−21.66=10−21.66/2.303=10−9.41≈3.9×10−10.
So only about 4 in 1010 states-worth of the budget makes it across. Tiny — yet enough for silicon electronics.
Recall Solution 2.2
Exponent for Ge: 0.05170.67=12.96, so the factor is e−12.96.
Ratio Ge to Si:
niSiniGe=e−(0.67−1.12)/(2×0.02585)=e+(0.45)/0.0517=e8.70
Convert: e8.70=108.70/2.303=103.78≈6×103.
Meaning: germanium has roughly 6000× more intrinsic carriers than silicon at room temperature — the smaller gap wins massively because it sits in an exponent.
Goal: reason about ratios, temperature changes, and which effect dominates.
Recall Solution 3.1
What: take the ratio of ni at two temperatures.
ni(300)ni(400)=exp[2kEg(3001−4001)]Why: the prefactor NcNv has only mild T3/2 dependence; the exponential dominates, so we ratio it.
First 2kEg=2×8.617×10−51.12=6499K.
Then 3001−4001=0.003333−0.002500=0.0008333K−1.
Product: 6499×0.0008333=5.416.
ni(300)ni(400)=e5.416=105.416/2.303=102.35≈225Meaning: a mere 100K rise multiplies free carriers by ~225×. This is why semiconductor devices are so temperature-sensitive.
Recall Solution 3.2
What: invert the ratio formula to solve for Eg.
1000=exp[2kEg(3001−6001)]
Take ln: ln1000=6.908.
The temperature bracket: 3001−6001=0.003333−0.001667=0.001667K−1.
So 2kEg×0.001667=6.908⇒2kEg=4144K.
Then Eg=2×8.617×10−5×4144=0.714eV.
Meaning: about 0.71eV — close to germanium. A "×1000 on doubling T" fingerprint pins the gap.
Goal: combine the carrier law with conductivity, mobility, and competing mechanisms.
Conductivity is σ=nqμ, where n is carrier count, q the electron charge, and μ the mobility (how fast carriers drift per unit field). See Conductivity and Mobility. This lets us pit "more carriers" against "worse mobility".
Recall Solution 4.1
What: in a metal Eg≈0, so e−Eg/2kT=e0=1 at every T → carrier count n is constant.
Then σ=nqμ moves only with μ. A 9% mobility drop means:
σ300σ330=μ300μ330=0.91Meaning: conductivity falls to 91% — resistance rises. This is the metal behaviour: heating helps nothing on carrier count and only adds scattering. See Temperature Dependence of Resistance in Metals.
Recall Solution 4.2
Step A — carrier factor.2kEg=6499K; 3001−3301=0.003333−0.003030=0.0003030K−1.
Product =6499×0.0003030=1.969, so n grows by e1.969=7.16.
Step B — mobility factor.μ falls to 0.80.
Step C — net conductivity.σ300σ330=carriers7.16×mobility0.80=5.73Meaning: conductivity rises ~5.7×. The exponential carrier gain crushes the modest mobility loss — the opposite of the metal. Same σ=nqμ equation, opposite winner.
Goal: full multi-step reasoning tying doping, intrinsic carriers, and orders of magnitude together.
Recall Solution 5.1
What: in equilibrium the product of electron and hole concentrations is fixed at ni2, regardless of doping — that is the mass-action law.
p=nni2=1.0×1016(1.0×1010)2=1.0×10161.0×1020=1.0×104cm−3Why: doping pushed n up by 106, so p must fall by 106 to keep the product constant.
Meaning: electrons (1016) outnumber holes (104) by 1012 → this is a strongly n-type material; electrons are the majority carriers and dominate conduction.
Recall Solution 5.2
What: we need ni to grow by 1016/1010=106.
Set the ratio of exponentials to 106:
106=exp[6499(3001−T1)]
Take ln: ln(106)=6×2.303=13.82.
So 6499(3001−T1)=13.82⇒3001−T1=0.002126.
Then T1=0.003333−0.002126=0.001207⇒T≈828K.
Meaning: you would need to heat silicon to about 828 K (∼555∘C) for intrinsic carriers to match a light doping. This is exactly why we dope: it delivers a 1016 carrier level at room temperature that thermal excitation alone could only reach by nearly melting the device. Doping engineers carriers; temperature is a blunt, unstable tool.