Level 4 — Application

Transistors - BJT & FET

60 minutes60 marksprintable — key stays hidden on paper

Level 4 — Application (novel problems, no hints) Time limit: 60 minutes Total marks: 60

Use ...... for inline math. Assume VT=25 mVV_T = 25\text{ mV} (thermal voltage) and VBE(on)=0.7 VV_{BE(on)} = 0.7\text{ V} unless stated otherwise. Show all working.


Question 1 — BJT Switch Design (12 marks)

An NPN BJT drives a relay coil modelled as a 120 Ω120\ \Omega resistor to a 12 V12\text{ V} rail. The transistor has β=60\beta = 60 (minimum guaranteed), VCE(sat)=0.2 VV_{CE(sat)} = 0.2\text{ V}, and VBE(sat)=0.8 VV_{BE(sat)} = 0.8\text{ V}. The base is driven from a 3.3 V3.3\text{ V} microcontroller GPIO through a base resistor RBR_B.

(a) Compute the collector current when the transistor is fully saturated. (2)

(b) Determine the minimum base current required to guarantee saturation, applying an overdrive factor of 33. (3)

(c) Calculate the largest standard base resistor RBR_B that still guarantees this overdrive. (3)

(d) The GPIO can source at most 8 mA8\text{ mA}. Verify whether your chosen RBR_B respects this limit, and state the resulting forced β\beta (βforced\beta_{forced}). (2)

(e) State one physical reason why operating deep in saturation slows the transistor's turn-OFF time. (2)


Question 2 — Common-Emitter Amplifier Analysis (14 marks)

A common-emitter amplifier uses voltage-divider bias: VCC=15 VV_{CC}=15\text{ V}, R1=47 kΩR_1=47\text{ k}\Omega, R2=10 kΩR_2=10\text{ k}\Omega, RC=2.2 kΩR_C=2.2\text{ k}\Omega, RE=470 ΩR_E=470\ \Omega (fully bypassed for AC). The BJT has β=150\beta=150.

(a) Find the DC base voltage VBV_B using the Thévenin approximation, then ICI_C. (4)

(b) Compute the transconductance gmg_m and the small-signal input resistance rπr_\pi. (3)

(c) Determine the mid-band voltage gain AvA_v assuming the emitter is fully bypassed and the output is unloaded. (3)

(d) A load RL=4.7 kΩR_L = 4.7\text{ k}\Omega is now AC-coupled to the output. Recompute AvA_v. (2)

(e) The bypass capacitor is removed. Re-derive the new gain expression and evaluate it. Comment on the trade-off. (2)


Question 3 — MOSFET Operating Point & Region (12 marks)

An NMOS transistor has Vth=0.8 VV_{th}=0.8\text{ V}, kn=μnCoxWL=0.5 mA/V2k_n = \mu_n C_{ox}\frac{W}{L} = 0.5\text{ mA/V}^2, and λ=0\lambda = 0. It is biased with VGS=2.0 VV_{GS}=2.0\text{ V} and a drain resistor RD=3 kΩR_D = 3\text{ k}\Omega from VDD=10 VV_{DD}=10\text{ V}; source is grounded.

(a) Assuming saturation, compute the drain current IDI_D (use ID=12kn(VGSVth)2I_D=\tfrac{1}{2}k_n(V_{GS}-V_{th})^2). (3)

(b) Compute VDSV_{DS} and verify the saturation assumption is consistent. (3)

(c) Compute the transconductance gmg_m at this operating point. (3)

(d) VGSV_{GS} is now increased to 4.0 V4.0\text{ V}. Show by calculation that the device has entered the triode region, and find the actual IDI_D. (3)


Question 4 — Body Effect & Subthreshold Leakage (12 marks)

An NMOS device has zero-bias threshold Vth0=0.5 VV_{th0}=0.5\text{ V}, body-effect coefficient γ=0.4 V1/2\gamma = 0.4\ \text{V}^{1/2}, and 2ϕF=0.7 V2\phi_F = 0.7\text{ V}. The body-effect model is: Vth=Vth0+γ(2ϕF+VSB2ϕF)V_{th} = V_{th0} + \gamma\left(\sqrt{2\phi_F + V_{SB}} - \sqrt{2\phi_F}\right)

(a) Compute VthV_{th} when VSB=1.5 VV_{SB} = 1.5\text{ V}. (3)

(b) In the subthreshold region, drain current follows ID=I0e(VGSVth)/(nVT)I_D = I_0\, e^{(V_{GS}-V_{th})/(nV_T)} with n=1.5n=1.5 and VT=25 mVV_T=25\text{ mV}. By what factor does IDI_D change if VGSV_{GS} drops by 100 mV100\text{ mV} below threshold? (3)

(c) Define the subthreshold swing SS and compute it for this device. (3)

(d) Explain how the body-effect result in (a) worsens leakage control in stacked transistors, and how it is exploited in "reverse body bias" for low-power modes. (3)


Question 5 — Device Selection & Reasoning (10 marks)

(a) A designer must switch a 5 V5\text{ V}, 2 A2\text{ A} load with a 3.3 V3.3\text{ V} logic signal and minimum static power. Choose between an enhancement NMOS (Vth=1.2 VV_{th}=1.2\text{ V}, RDS(on)=25 mΩR_{DS(on)}=25\text{ m}\Omega) and an NPN BJT (β=100\beta=100, VCE(sat)=0.3 VV_{CE(sat)}=0.3\text{ V}). Justify your choice quantitatively (conduction loss and drive requirements). (5)

(b) Explain why a JFET and a depletion-mode MOSFET are both "normally-ON" devices, and give one circuit consequence of this property. (3)

(c) State two distinct short-channel effects and their impact on threshold voltage or leakage. (2)

Answer keyMark scheme & solutions

Question 1

(a) Saturated collector current: IC=VCCVCE(sat)RC=120.2120=11.8120=98.3 mAI_C = \frac{V_{CC}-V_{CE(sat)}}{R_C} = \frac{12-0.2}{120} = \frac{11.8}{120} = 98.3\text{ mA} Why: In saturation VCEV_{CE} is fixed at VCE(sat)V_{CE(sat)}; the coil resistance sets ICI_C. (2)

(b) Base current at edge of saturation: IB(edge)=IC/β=98.3/60=1.64 mAI_{B(edge)} = I_C/\beta = 98.3/60 = 1.64\text{ mA}. With overdrive factor 3: IB=3×1.64=4.92 mAI_B = 3\times1.64 = 4.92\text{ mA}. Why: Overdrive guarantees saturation despite β\beta/temperature spread. (3)

(c) RB=VGPIOVBE(sat)IB=3.30.84.92 mA=2.54.92 mA=508 ΩR_B = \dfrac{V_{GPIO}-V_{BE(sat)}}{I_B} = \dfrac{3.3-0.8}{4.92\text{ mA}} = \dfrac{2.5}{4.92\text{ mA}} = 508\ \Omega. Largest standard resistor below this: RB=470 ΩR_B = 470\ \Omega (E12). (3)

(d) With RB=470 ΩR_B=470\ \Omega: IB=(3.30.8)/470=5.32 mA<8 mAI_B=(3.3-0.8)/470 = 5.32\text{ mA} < 8\text{ mA} → GPIO limit respected. βforced=IC/IB=98.3/5.32=18.5\beta_{forced}=I_C/I_B = 98.3/5.32 = 18.5. (2)

(e) In saturation both junctions are forward-biased, storing excess minority charge in the base (stored/saturation charge). Turn-off must first remove this charge before the collector current can fall → storage delay. (2)


Question 2

(a) Vtheˊv=VCCR2R1+R2=15×1057=2.63 VV_{th\acute e v}=V_{CC}\dfrac{R_2}{R_1+R_2}=15\times\dfrac{10}{57}=2.63\text{ V}, Rth=R1R2=4710=8.25 kΩR_{th}=R_1\|R_2=47\|10=8.25\text{ k}\Omega. ICVtheˊv0.7RE+Rth/β=1.93470+55=1.93525=3.68 mAI_C \approx \dfrac{V_{th\acute ev}-0.7}{R_E + R_{th}/\beta}=\dfrac{1.93}{470+55}=\dfrac{1.93}{525}=3.68\text{ mA}. (Simplified ignoring Rth/βR_{th}/\beta: IC=1.93/470=4.11 mAI_C=1.93/470=4.11\text{ mA} — accept either; use 4.0 mA\approx4.0\text{ mA}.) (4)

Using IC=4.0 mAI_C=4.0\text{ mA} for the rest:

(b) gm=IC/VT=4.0 mA/25 mV=160 mA/V=0.16 Sg_m = I_C/V_T = 4.0\text{ mA}/25\text{ mV}=160\text{ mA/V}=0.16\text{ S}. rπ=β/gm=150/0.16=937 Ωr_\pi = \beta/g_m = 150/0.16 = 937\ \Omega. (3)

(c) With emitter bypassed: Av=gmRC=0.16×2200=352A_v = -g_m R_C = -0.16\times2200 = -352. (3)

(d) RCRL=2.24.7=1.5 kΩR_C\|R_L = 2.2\|4.7 = 1.5\text{ k}\Omega. Av=gm(RCRL)=0.16×1500=240A_v=-g_m(R_C\|R_L)=-0.16\times1500=-240. (2)

(e) Unbypassed: Av=gmRC1+gmRE=RC1/gm+RERCRE=2200470=4.68A_v = -\dfrac{g_m R_C}{1+g_m R_E}=-\dfrac{R_C}{1/g_m + R_E}\approx -\dfrac{R_C}{R_E}=-\dfrac{2200}{470}=-4.68. Trade-off: gain collapses dramatically but bandwidth, linearity and gain-stability improve (local negative feedback). (2)


Question 3

(a) ID=12kn(VGSVth)2=12(0.5)(2.00.8)2=0.25×1.44=0.36 mAI_D=\tfrac12 k_n(V_{GS}-V_{th})^2=\tfrac12(0.5)(2.0-0.8)^2=0.25\times1.44=0.36\text{ mA}. (3)

(b) VDS=VDDIDRD=100.36×3=101.08=8.92 VV_{DS}=V_{DD}-I_D R_D = 10 - 0.36\times3 = 10-1.08 = 8.92\text{ V}. Saturation requires VDSVGSVth=1.2 VV_{DS}\ge V_{GS}-V_{th}=1.2\text{ V}. Since 8.92>1.28.92>1.2 ✓ consistent. (3)

(c) gm=kn(VGSVth)=0.5×1.2=0.6 mA/Vg_m = k_n(V_{GS}-V_{th}) = 0.5\times1.2 = 0.6\text{ mA/V}. (Equivalently gm=2knID=2×0.5×0.36=0.6 mA/Vg_m=\sqrt{2k_n I_D}=\sqrt{2\times0.5\times0.36}=0.6\text{ mA/V}.) (3)

(d) At VGS=4.0V_{GS}=4.0, assume saturation: ID=12(0.5)(40.8)2=0.25×10.24=2.56 mAI_D=\tfrac12(0.5)(4-0.8)^2=0.25\times10.24=2.56\text{ mA}VDS=102.56×3=2.32 VV_{DS}=10-2.56\times3=2.32\text{ V}. Overdrive VGSVth=3.2 V>VDS=2.32V_{GS}-V_{th}=3.2\text{ V} > V_{DS}=2.32 → assumption fails, device is in triode. Solve triode: ID=kn[(VGSVth)VDS12VDS2]I_D=k_n[(V_{GS}-V_{th})V_{DS}-\tfrac12 V_{DS}^2] with VDS=10IDRDV_{DS}=10-I_D R_D. Let x=VDSx=V_{DS}: ID=(10x)/3I_D=(10-x)/3 (mA). (10x)/3=0.5[3.2x0.5x2](10-x)/3 = 0.5[3.2x-0.5x^2] (10x)/3=1.6x0.25x2(10-x)/3 = 1.6x - 0.25x^2 10x=4.8x0.75x210-x = 4.8x - 0.75x^2 0.75x25.8x+10=0x27.733x+13.33=00.75x^2 -5.8x +10=0 \Rightarrow x^2 -7.733x +13.33=0 x=7.733±59.853.32=7.733±2.552x=\dfrac{7.733\pm\sqrt{59.8-53.3}}{2}=\dfrac{7.733\pm2.55}{2}x=2.59 Vx=2.59\text{ V} (physical root <overdrive). ID=(102.59)/3=2.47 mAI_D=(10-2.59)/3 = 2.47\text{ mA}. (3)


Question 4

(a) Vth=0.5+0.4(0.7+1.50.7)=0.5+0.4(2.20.7)V_{th}=0.5+0.4(\sqrt{0.7+1.5}-\sqrt{0.7})=0.5+0.4(\sqrt{2.2}-\sqrt{0.7}) =0.5+0.4(1.4830.837)=0.5+0.4(0.646)=0.5+0.258=0.758 V=0.5+0.4(1.483-0.837)=0.5+0.4(0.646)=0.5+0.258=0.758\text{ V}. (3)

(b) Factor =e100/(1.5×25)=e100/37.5=e2.667=0.0697114.4=e^{-100/(1.5\times25)}=e^{-100/37.5}=e^{-2.667}=0.0697\approx\tfrac{1}{14.4}. IDI_D decreases by a factor of ~14 (drops to ~7% of threshold value). (3)

(c) Subthreshold swing = gate voltage change for one decade of IDI_D: S=nVTln(10)=1.5×25 mV×2.303=86.4 mV/decade.S = n\,V_T \ln(10) = 1.5\times25\text{ mV}\times2.303 = 86.4\text{ mV/decade}. Why: Steeper (smaller) SS means sharper on/off transition; ideal limit 60 mV/dec60\text{ mV/dec} at n=1n=1. (3)

(d) In a stack, lower transistors raise the source of upper transistors, giving VSB>0V_{SB}>0 → body effect raises their VthV_{th} (as in (a), +0.26 V), which reduces subthreshold leakage — this "stack effect" is actively helpful for leakage. Reverse body bias applies VSB>0V_{SB}>0 deliberately in standby to raise VthV_{th} and exponentially cut leakage, trading some speed for lower static power. (3)


Question 5

(a) NMOS: conduction loss =I2RDS(on)=22×0.025=0.1 W=I^2 R_{DS(on)} = 2^2\times0.025 = 0.1\text{ W}; gate draws ~zero static current (voltage-controlled). But note VGS=3.3 VV_{GS}=3.3\text{ V} with Vth=1.2 VV_{th}=1.2\text{ V} gives 2.1 V\sim2.1\text{ V} overdrive — usable for logic-level FET. BJT: saturation loss =VCE(sat)×IC=0.3×2=0.6 W=V_{CE(sat)}\times I_C = 0.3\times2 = 0.6\text{ W}; base needs IBIC/β=2/100=20 mAI_B\ge I_C/\beta=2/100=20\text{ mA} continuous drive → static drive power + 6× higher conduction loss. Choice: NMOS — 6× lower conduction loss (0.1 W vs 0.6 W) and negligible static drive current → minimum static power. (5)

(b) Both conduct at VGS=0V_{GS}=0: the JFET channel exists until a reverse gate voltage pinches it off; the depletion-MOSFET has a pre-formed (implanted) channel. Both need a gate voltage to turn off. Circuit consequence: a fault/floating gate leaves them conducting — need pull-off bias; also useful as constant-current source / self-biased load. (3)

(c) Any two: (i) DIBL (drain-induced barrier lowering) — high VDSV_{DS} lowers the barrier, reducing effective VthV_{th} and raising leakage. (ii) Velocity saturation — carriers hit max drift velocity, current no longer Vov2\propto V_{ov}^2. (iii) VthV_{th} roll-off — short channels have lower VthV_{th} due to charge sharing. (iv) Punch-through — depletion regions merge, large leakage. (2)


[
  {"claim":"Q1a saturated Ic = 98.3 mA","code":"Ic=(12-0.2)/120; result=abs(Ic-0.09833)<1e-4"},
  {"claim":"Q1c minimum RB before rounding ~508 ohm","code":"Ib=3*( (12-0.2)/120 )/60; RB=(3.3-0.8)/Ib; result=abs(RB-508)<3"},
  {"claim":"Q3a Id saturation = 0.36 mA","code":"Id=Rational(1,2)*Rational(1,2)*(2.0-0.8)**2; result=abs(float(Id)-0.36)<1e-6"},
  {"claim":"Q3d triode Id ~2.47 mA","code":"x=symbols('x'); sol=solve(Eq((10-x)/3,0.5*(3.2*x-0.5*x**2)),x); vals=[float(s) for s in sol if float(s)>0 and float(s)<3.2]; Idt=(10-vals[0])/3; result=abs(Idt-2.47)<0.05"},
  {"claim":"Q4a Vth with body effect = 0.758 V","code":"import sympy as sp; Vth=0.5+0.4*(sp.sqrt(2.2)-sp.sqrt(0.7)); result=abs(float(Vth)-0.758)<1e-3"},
  {"claim":"Q4c subthreshold swing = 86.4 mV/dec","code":"import sympy as sp; S=1.5*25*float(sp.log(10)); result=abs(S-86.