Level 3 — ProductionMaterials & Atomic Structure

Materials & Atomic Structure

45 minutes60 marksprintable — key stays hidden on paper

Chapter: 1.3 Materials & Atomic Structure Level: 3 — Production (from-scratch derivations, explain-out-loud) Time Limit: 45 minutes Total Marks: 60

Instructions: Show all working. Where a derivation is requested, start from stated first principles. Use ...... notation for equations. State assumptions.


Question 1 — Bohr Model from First Principles (12 marks)

Starting from the two Bohr postulates (Coulomb force provides centripetal force, and angular momentum is quantised as L=nL = n\hbar), derive from scratch:

(a) An expression for the radius rnr_n of the nn-th electron orbit in a hydrogen-like atom of nuclear charge ZZ. (5)

(b) An expression for the total energy EnE_n of the electron in that orbit. (5)

(c) Compute the ground-state radius (n=1n=1, Z=1Z=1) numerically and state the standard name for this quantity. (2)

Constants: ε0=8.854×1012 F/m\varepsilon_0 = 8.854\times10^{-12}\ \text{F/m}, me=9.11×1031 kgm_e = 9.11\times10^{-31}\ \text{kg}, e=1.602×1019 Ce = 1.602\times10^{-19}\ \text{C}, =1.055×1034 J⋅s\hbar = 1.055\times10^{-34}\ \text{J·s}.


Question 2 — Silicon Bonding & Lattice (10 marks)

(a) Silicon has atomic number 14. Write out its electron shell filling and explain why it has 4 valence electrons. (3)

(b) Explain-out-loud (in words + a labelled sketch description) how covalent bonding produces a complete outer shell for each Si atom in a pure crystal. (4)

(c) Name the crystal lattice structure silicon adopts and state its coordination number. (3)


Question 3 — Intrinsic Carrier Concentration & Temperature (12 marks)

The intrinsic carrier concentration follows: ni=AT3/2exp ⁣(Eg2kBT)n_i = A\,T^{3/2}\exp\!\left(-\frac{E_g}{2k_BT}\right)

(a) Explain physically why the factor of 2 appears in the denominator of the exponent. (2)

(b) For silicon, Eg=1.12 eVE_g = 1.12\ \text{eV}. Taking the exponential term to dominate, compute the ratio ni(350K)/ni(300K)n_i(350\text{K})/n_i(300\text{K}), including the T3/2T^{3/2} prefactor. (6)

(c) Based on your answer, explain qualitatively why semiconductor conductivity rises with temperature while metal conductivity falls. (4)

Constant: kB=8.617×105 eV/Kk_B = 8.617\times10^{-5}\ \text{eV/K}.


Question 4 — Extrinsic Doping & Conductivity (10 marks)

(a) Distinguish intrinsic from extrinsic semiconductors in one sentence each. (2)

(b) Derive the conductivity expression σ=q(nμn+pμp)\sigma = q(n\mu_n + p\mu_p) from the drift-current definition J=σEJ = \sigma E and the carrier drift velocity vd=μEv_d = \mu E. Explain each symbol. (5)

(c) An n-type Si sample is doped with Nd=1×1016 cm3N_d = 1\times10^{16}\ \text{cm}^{-3} donors (fully ionised). With μn=1350 cm2/V⋅s\mu_n = 1350\ \text{cm}^2/\text{V·s}, compute the conductivity, neglecting holes. State units. (3)

Use q=1.602×1019 Cq = 1.602\times10^{-19}\ \text{C}.


Question 5 — Silicon vs Germanium vs Compounds (10 marks)

(a) Give three distinct technical reasons why silicon dominates over germanium in the electronics industry. (3)

(b) For each compound semiconductor below, state one property that makes it preferred over silicon for a specific application, and name that application: GaN, GaAs, SiC. (6)

(c) State one drawback compound semiconductors have compared with silicon. (1)


Question 6 — Electron–Hole Pairs & Mobility (6 marks)

(a) Describe the electron–hole pair generation process when a valence electron absorbs thermal energy. (3)

(b) Define carrier mobility and state the two microscopic factors that reduce it as temperature rises. (3)


Answer keyMark scheme & solutions

Question 1 (12 marks)

(a) Radius derivation (5)

Coulomb = centripetal: 14πε0Ze2r2=mev2r(1)\frac{1}{4\pi\varepsilon_0}\frac{Ze^2}{r^2} = \frac{m_e v^2}{r} \quad(1) Quantisation: mevr=nv=nmerm_e v r = n\hbar \Rightarrow v = \frac{n\hbar}{m_e r} (1)

Substitute vv into (1): Ze24πε0r=men22me2r2\frac{Ze^2}{4\pi\varepsilon_0 r} = m_e \frac{n^2\hbar^2}{m_e^2 r^2} (1)

Solve for rr: rn=4πε0n22meZe2\boxed{r_n = \frac{4\pi\varepsilon_0 n^2\hbar^2}{m_e Z e^2}} (2)

(b) Energy derivation (5)

KE =12mev2=18πε0Ze2r= \tfrac12 m_e v^2 = \frac{1}{8\pi\varepsilon_0}\frac{Ze^2}{r} (from (1)) (1) PE =14πε0Ze2r= -\frac{1}{4\pi\varepsilon_0}\frac{Ze^2}{r} (1) Total E=KE+PE=18πε0Ze2rE = KE + PE = -\frac{1}{8\pi\varepsilon_0}\frac{Ze^2}{r} (1)

Insert rnr_n: En=meZ2e48ε02h2n2=meZ2e432π2ε022n2\boxed{E_n = -\frac{m_e Z^2 e^4}{8\varepsilon_0^2 h^2 n^2} = -\frac{m_e Z^2 e^4}{32\pi^2\varepsilon_0^2\hbar^2 n^2}} (2) (Standard result gives 13.6Z2/n2-13.6\,Z^2/n^2 eV.)

(c) Numerical (2)

r1=4π(8.854×1012)(1.055×1034)2(9.11×1031)(1.602×1019)25.29×1011 mr_1 = \frac{4\pi(8.854\times10^{-12})(1.055\times10^{-34})^2}{(9.11\times10^{-31})(1.602\times10^{-19})^2}\approx 5.29\times10^{-11}\ \text{m} (1) = Bohr radius a00.529 A˚a_0 \approx 0.529\ \text{Å} (1)


Question 2 (10 marks)

(a) Filling: 1s22s22p63s23p21s^2\,2s^2\,2p^6\,3s^2\,3p^2 (or shells 2,8,4). (2) The outermost shell (n=3n=3) contains 3s23p23s^2 3p^2 = 4 electrons → 4 valence electrons. (1)

(b) Each Si atom shares one electron with each of its 4 neighbours, forming 4 covalent bonds. Each shared pair counts toward both atoms' outer shells, giving each atom an effective 8 outer electrons (stable octet). Sketch: central Si with 4 lines to 4 neighbours, each line = shared electron pair. (4) (2 for mechanism, 2 for octet completion / sketch)

(c) Diamond cubic lattice; coordination number = 4 (tetrahedral). (3) (2 lattice, 1 coordination)


Question 3 (12 marks)

(a) Creating one free electron simultaneously creates one hole; the energy EgE_g is shared/the equilibrium involves both carrier types, and the Fermi level sits mid-gap, so the activation energy per carrier is Eg/2E_g/2. (2)

(b) Exponent term: exp[Eg/(2kB)(1/3501/300)]\exp[-E_g/(2k_B)\,(1/350 - 1/300)]. Eg/(2kB)=1.12/(2×8.617×105)=6498.8 K-E_g/(2k_B) = -1.12/(2\times8.617\times10^{-5}) = -6498.8\ \text{K} 1/3501/300=0.00285710.0033333=4.7619×1041/350 - 1/300 = 0.0028571 - 0.0033333 = -4.7619\times10^{-4} Exponent =(6498.8)(4.7619×104)=3.0947= (-6498.8)(-4.7619\times10^{-4}) = 3.0947 exp(3.0947)=22.08\exp(3.0947) = 22.08 (4) Prefactor: (350/300)3/2=(1.1667)1.5=1.260(350/300)^{3/2} = (1.1667)^{1.5} = 1.260 (1) Ratio =22.08×1.26027.8= 22.08 \times 1.260 \approx 27.8 (1)

(c) In semiconductors, raising TT generates exponentially more electron–hole pairs (more carriers), so σ\sigma rises despite reduced mobility. In metals the carrier count is already fixed/huge; heating only increases lattice vibrations (phonon scattering), lowering mobility and hence σ\sigma. (4)


Question 4 (10 marks)

(a) Intrinsic: pure semiconductor where carriers come only from thermal EHP generation (n=p=nin=p=n_i). Extrinsic: deliberately doped with impurities so one carrier type dominates. (2)

(b) J=qnvdn+qpvdpJ = q n v_{dn} + q p v_{dp} (charge × density × drift velocity, summed over both carriers). (1) Substitute vd=μEv_d = \mu E: J=q(nμn+pμp)EJ = q(n\mu_n + p\mu_p)E. (2) Compare with J=σEJ = \sigma E: σ=q(nμn+pμp)\sigma = q(n\mu_n + p\mu_p). (1) Symbols: qq elementary charge, n,pn,p electron/hole densities, μ\mu mobilities, EE field. (1)

(c) nNd=1016 cm3n \approx N_d = 10^{16}\ \text{cm}^{-3}. σ=qnμn=(1.602×1019)(1016)(1350)\sigma = q n \mu_n = (1.602\times10^{-19})(10^{16})(1350) =1.602×1019×1.35×1019=2.163 (Ωcm)1= 1.602\times10^{-19}\times1.35\times10^{19} = 2.163\ (\Omega\cdot\text{cm})^{-1} (3)


Question 5 (10 marks)

(a) Any three (1 each): native stable oxide SiO2\text{SiO}_2 (excellent insulator/gate dielectric); wider band gap → lower leakage & higher operating temperature than Ge; abundant/cheap (sand); higher melting point & mechanical robustness for processing. (3)

(b) (2 each — property + application)

  • GaN: wide bandgap (~3.4 eV) → high breakdown voltage/high-frequency → power electronics / fast chargers / RF amplifiers.
  • GaAs: high electron mobility & direct bandgap → high-speed RF / optoelectronics (LEDs, laser diodes, solar cells).
  • SiC: very wide bandgap & high thermal conductivity → high-temperature, high-power devices (EV inverters). (6)

(c) More expensive / harder to manufacture / lacks a high-quality native oxide. (1)


Question 6 (6 marks)

(a) A valence electron absorbs thermal energy Eg\geq E_g, breaking a covalent bond and jumping to the conduction band, leaving behind a vacancy (hole) in the valence band. Electron and hole are both mobile charge carriers. (3)

(b) Mobility μ=vd/E\mu = v_d/E — drift velocity per unit electric field. As TT rises: (1) increased lattice/phonon scattering and (2) more thermal agitation → shorter mean free time → lower μ\mu. (Ionised-impurity scattering dominates only at low T.) (3)

[
  {"claim":"Bohr ground-state radius ~5.29e-11 m","code":"eps0=8.854e-12; hbar=1.055e-34; me=9.11e-31; e=1.602e-19; r1=4*pi*eps0*hbar**2/(me*e**2); result = abs(float(r1)-5.29e-11) < 0.05e-11"},
  {"claim":"ni(350)/ni(300) ratio ~27.8","code":"Eg=1.12; kB=8.617e-5; import math; expterm=math.exp(-Eg/(2*kB)*(1/350-1/300)); pre=(350/300)**1.5; ratio=expterm*pre; result = abs(ratio-27.8) < 1.0"},
  {"claim":"n-type conductivity ~2.16 (ohm-cm)^-1","code":"q=1.602e-19; n=1e16; mun=1350; sigma=q*n*mun; result = abs(sigma-2.163) < 0.01"},
  {"claim":"T^3/2 prefactor at 350/300 ~1.26","code":"pre=(350/300)**1.5; result = abs(pre-1.260) < 0.005"}
]