Materials & Atomic Structure
Level 1 Examination: Recognition
Time limit: 20 minutes Total marks: 40
Section A — Multiple Choice (1 mark each)
Select the single best answer.
Q1. According to the Bohr model, the maximum number of electrons in the third shell (n = 3) is:
- (a) 2 (b) 8 (c) 18 (d) 32
Q2. How many valence electrons does a silicon atom have?
- (a) 2 (b) 4 (c) 6 (d) 8
Q3. In a pure silicon crystal, each atom forms covalent bonds with how many neighbouring atoms?
- (a) 2 (b) 3 (c) 4 (d) 6
Q4. An intrinsic semiconductor is one that is:
- (a) heavily doped with phosphorus
- (b) pure, with no added impurities
- (c) doped with boron
- (d) a metal alloy
Q5. When a covalent bond in silicon breaks due to thermal energy, it creates:
- (a) a free electron only
- (b) a hole only
- (c) an electron–hole pair
- (d) a positive ion only
Q6. As temperature increases, the electrical conductivity of an intrinsic semiconductor:
- (a) decreases
- (b) stays constant
- (c) increases
- (d) drops to zero
Q7. Carrier mobility is best described as:
- (a) the number of carriers per unit volume
- (b) the drift velocity of a carrier per unit electric field
- (c) the charge on a carrier
- (d) the energy gap of the material
Q8. The maximum number of electrons a single atomic shell can hold is given by:
- (a) (b) (c) (d)
Q9. Which semiconductor is preferred for high-temperature, high-power, and high-frequency applications such as LEDs and RF devices?
- (a) Germanium (b) Compound semiconductors like GaN/GaAs (c) Copper (d) Carbon
Q10. The bandgap of silicon at room temperature is approximately:
- (a) 0.67 eV (b) 1.12 eV (c) 3.4 eV (d) 5.5 eV
Section B — Matching (1 mark each, 6 marks)
Q11. Match each material/term in Column X to its correct property in Column Y.
| Column X | Column Y |
|---|---|
| (i) Germanium | (A) Wide bandgap, used in blue LEDs |
| (ii) GaAs | (B) Small bandgap (~0.67 eV), leaky at high temp |
| (iii) GaN | (C) High electron mobility, used in RF/microwave |
| (iv) Silicon | (D) Abundant, forms stable native oxide (SiO₂) |
| (v) SiC | (E) High thermal conductivity, high-power devices |
| (vi) Hole | (F) Absence of an electron, behaves as +charge |
Section C — True/False with Justification (3 marks each: 1 for T/F, 2 for justification)
Q12. "Silicon dominates over germanium mainly because silicon is cheaper and forms a stable insulating oxide layer." — True or False? Justify.
Q13. "In an extrinsic n-type semiconductor, holes are the majority carriers." — True or False? Justify.
Q14. "Doping intrinsic silicon with a Group V element (e.g., phosphorus) increases the number of free electrons." — True or False? Justify.
Q15. "At absolute zero temperature (0 K), pure silicon behaves like a perfect insulator." — True or False? Justify.
Q16. "Carrier mobility is independent of temperature in a semiconductor." — True or False? Justify.
END OF PAPER
Answer keyMark scheme & solutions
Section A — MCQ (1 mark each)
Q1 — (c) 18. Shell capacity is ; for , . (1 mark)
Q2 — (b) 4. Silicon is in Group IV, so it has 4 valence electrons. (1 mark)
Q3 — (c) 4. Each Si atom shares its 4 valence electrons with 4 neighbours to complete an octet. (1 mark)
Q4 — (b) pure, with no added impurities. Intrinsic = pure material; conductivity due only to thermally generated pairs. (1 mark)
Q5 — (c) an electron–hole pair. A freed electron leaves behind a vacancy (hole); they are always created together. (1 mark)
Q6 — (c) increases. Higher temperature breaks more bonds → more carriers → higher conductivity (opposite to metals). (1 mark)
Q7 — (b) drift velocity per unit electric field. , units m²/(V·s). (1 mark)
Q8 — (c) . Standard shell-filling rule. (1 mark)
Q9 — (b) Compound semiconductors like GaN/GaAs. Wide/direct bandgaps suit high-power, high-freq, optoelectronic use. (1 mark)
Q10 — (b) 1.12 eV. Standard room-temperature bandgap of silicon. (1 mark)
Section B — Matching (1 mark each)
Q11:
- (i) Germanium → B (small bandgap ~0.67 eV, leaky at high temp)
- (ii) GaAs → C (high electron mobility, RF/microwave)
- (iii) GaN → A (wide bandgap, blue LEDs)
- (iv) Silicon → D (abundant, stable SiO₂)
- (v) SiC → E (high thermal conductivity, high-power)
- (vi) Hole → F (absence of electron, +charge behaviour)
(6 marks total, 1 each)
Section C — True/False with Justification
Q12 — TRUE. (T/F = 1) Justification: Silicon is more abundant/cheaper than germanium, and crucially forms SiO₂, a stable, high-quality native oxide used as an insulator/mask in fabrication — germanium's oxide is water-soluble and unstable. (2 marks)
Q13 — FALSE. (T/F = 1) Justification: In n-type material, donor doping supplies extra electrons, so electrons are the majority carriers and holes are the minority. (2 marks)
Q14 — TRUE. (T/F = 1) Justification: A Group V atom has 5 valence electrons; 4 bond with silicon and the 5th is loosely bound and easily freed, adding conduction electrons (donor). (2 marks)
Q15 — TRUE. (T/F = 1) Justification: At 0 K there is no thermal energy to break covalent bonds, so no free carriers exist → no conduction → behaves as an insulator. (2 marks)
Q16 — FALSE. (T/F = 1) Justification: Mobility decreases with rising temperature because increased lattice vibrations (phonon scattering) impede carrier drift. (2 marks)
[
{"claim": "Third shell capacity 2n^2 = 18 for n=3", "code": "n=3; result = (2*n**2 == 18)"},
{"claim": "Silicon Group IV has 4 valence electrons matching 4 covalent neighbours", "code": "valence=4; neighbours=4; result = (valence == neighbours == 4)"},
{"claim": "Second shell (n=2) capacity is 8 electrons", "code": "n=2; result = (2*n**2 == 8)"},
{"claim": "Silicon bandgap 1.12 eV exceeds germanium 0.67 eV", "code": "si=1.12; ge=0.67; result = (si > ge)"}
]