Level 4 — ApplicationDoping & PN Junctions

Doping & PN Junctions

60 minutes60 marksprintable — key stays hidden on paper

Level 4 — Application (novel problems, no hints) Time limit: 60 minutes Total marks: 60

Use the following constants where needed: k=1.381×1023J/Kk = 1.381\times10^{-23}\,\text{J/K}, q=1.602×1019Cq = 1.602\times10^{-19}\,\text{C}, thermal voltage VT=kT/q25.85mVV_T = kT/q \approx 25.85\,\text{mV} at T=300KT=300\,\text{K}, ni=1.5×1010cm3n_i = 1.5\times10^{10}\,\text{cm}^{-3} for silicon, εSi=11.7ε0\varepsilon_{Si} = 11.7\,\varepsilon_0, ε0=8.854×1012F/m\varepsilon_0 = 8.854\times10^{-12}\,\text{F/m}.


Question 1 — Doping & built-in potential (12 marks)

A silicon PN junction is fabricated by doping the p-side with boron at NA=2×1017cm3N_A = 2\times10^{17}\,\text{cm}^{-3} and the n-side with phosphorus at ND=5×1015cm3N_D = 5\times10^{15}\,\text{cm}^{-3}. Assume full ionisation at T=300KT=300\,\text{K}.

(a) State which atom is the donor and which is the acceptor, and give the majority carrier on each side. (3)

(b) Compute the built-in potential VbiV_{bi} of the junction. (4)

(c) The n-side phosphorus concentration is increased by a factor of 100. By how many millivolts does VbiV_{bi} change, and in which direction? Justify without full recomputation. (3)

(d) Sketch and label the energy-band diagram of the isolated n-type material, showing ECE_C, EVE_V, EFE_F and the donor level EDE_D. (2)


Question 2 — Depletion region & junction capacitance (14 marks)

Use the junction of Question 1 (NA=2×1017N_A = 2\times10^{17}, ND=5×1015cm3N_D = 5\times10^{15}\,\text{cm}^{-3}, VbiV_{bi} from Q1b).

(a) Compute the total depletion width WW at zero bias. (4)

(b) Determine the fraction of WW that lies in the n-side, and explain physically why the depletion region is asymmetric. (3)

(c) The junction has cross-sectional area A=104cm2A = 10^{-4}\,\text{cm}^2. Compute the zero-bias depletion (junction) capacitance. (3)

(d) The diode is reverse-biased at VR=5VV_R = 5\,\text{V}. Compute the new depletion capacitance and state the ratio to the zero-bias value. Explain why a reverse-biased diode behaves as a voltage-controlled capacitor. (4)


Question 3 — Shockley equation & I-V behaviour (14 marks)

A silicon diode has reverse saturation current IS=2×1014AI_S = 2\times10^{-14}\,\text{A} at 300K300\,\text{K} and ideality factor n=1n=1.

(a) Compute the forward current at V=0.60VV = 0.60\,\text{V}. (3)

(b) Determine the voltage increase required to raise the forward current by a factor of 10. (3)

(c) At V=2VV = -2\,\text{V}, compute the current predicted by the Shockley equation and comment on how this compares to the actual reverse current of a real diode. (3)

(d) A designer measures the same diode and finds that raising the current tenfold requires 118mV118\,\text{mV}, not the value from part (b). Compute the effective ideality factor nn and briefly state one physical mechanism that produces n>1n>1. (3)

(e) State one reason the Shockley equation fails to describe behaviour near reverse breakdown. (2)


Question 4 — Reverse breakdown & temperature (10 marks)

Two silicon Zener diodes are specified: Diode A breaks down at 4.3V4.3\,\text{V}, Diode B at 12V12\,\text{V}.

(a) For each diode, identify whether the breakdown is dominated by the Zener mechanism or the avalanche mechanism, and justify using the physics of each. (4)

(b) State and explain the sign of the temperature coefficient of breakdown voltage for each diode. (3)

(c) A designer needs a reference voltage that is nearly temperature independent. Explain, using your answers above, how combining diodes of the two types could achieve this. (3)


Question 5 — Reverse saturation current & scaling (10 marks)

The reverse saturation current of a junction can be written IS=qAni2(DpLpND+DnLnNA).I_S = qA\,n_i^2\left(\frac{D_p}{L_p N_D} + \frac{D_n}{L_n N_A}\right).

(a) A junction has IS=1×1013AI_S = 1\times10^{-13}\,\text{A} at 300K300\,\text{K}. Estimate ISI_S at 350K350\,\text{K}, given that ni2T3eEg/kTn_i^2 \propto T^3 e^{-E_g/kT} with Eg=1.12eVE_g = 1.12\,\text{eV} (treat the pre-factors D/LD/L as constant). (5)

(b) Using your result, estimate the factor by which the reverse leakage current of a silicon diode changes for each 10K10\,\text{K} rise near room temperature, and state the common "doubles per ~10 °C" rule of thumb. (3)

(c) The p-side doping NAN_A is increased tenfold while the p-side term dominates ISI_S. State the effect on ISI_S and hence on the diode's forward voltage at fixed current. (2)


End of paper

Answer keyMark scheme & solutions

Question 1

(a) Phosphorus = donor (n-side); boron = acceptor (p-side). (1) n-side majority carriers = electrons; p-side majority carriers = holes. (2)

(b) Vbi=VTln ⁣NANDni2V_{bi} = V_T \ln\!\dfrac{N_A N_D}{n_i^2}. (1) NANDni2=(2×1017)(5×1015)(1.5×1010)2=1×10332.25×1020=4.44×1012\dfrac{N_A N_D}{n_i^2} = \dfrac{(2\times10^{17})(5\times10^{15})}{(1.5\times10^{10})^2} = \dfrac{1\times10^{33}}{2.25\times10^{20}} = 4.44\times10^{12}. (1) ln(4.44×1012)=29.12\ln(4.44\times10^{12}) = 29.12. (1) Vbi=0.02585×29.12=0.753VV_{bi} = 0.02585 \times 29.12 = 0.753\,\text{V}. (1)

(c) ΔVbi=VTln(100)=0.02585×4.605=0.119V\Delta V_{bi} = V_T\ln(100) = 0.02585 \times 4.605 = 0.119\,\text{V} increase (~+119 mV). (2) Increasing NDN_D raises the doping product, so VbiV_{bi} rises logarithmically. (1)

(d) Diagram: ECE_C at top, EVE_V at bottom, donor level EDE_D just below ECE_C; EFE_F close to ECE_C (above mid-gap). (2)


Question 2

(a) W=2εSiq(1NA+1ND)VbiW = \sqrt{\dfrac{2\varepsilon_{Si}}{q}\left(\dfrac{1}{N_A}+\dfrac{1}{N_D}\right)V_{bi}}. (1) εSi=11.7×8.854×1012=1.036×1010F/m\varepsilon_{Si}=11.7\times8.854\times10^{-12}=1.036\times10^{-10}\,\text{F/m}. Convert doping to m3^{-3}: NA=2×1023N_A=2\times10^{23}, ND=5×1021N_D=5\times10^{21}. 1NA+1ND=5×1024+2×1022=2.05×1022m3\dfrac{1}{N_A}+\dfrac{1}{N_D}=5\times10^{-24}+2\times10^{-22}=2.05\times10^{-22}\,\text{m}^3. (1) 2εq=2×1.036×10101.602×1019=1.293×109\dfrac{2\varepsilon}{q}=\dfrac{2\times1.036\times10^{-10}}{1.602\times10^{-19}}=1.293\times10^{9}. W=1.293×109×2.05×1022×0.753W=\sqrt{1.293\times10^9 \times 2.05\times10^{-22}\times0.753} (1) =1.996×1013=4.47×107m=0.447μm=\sqrt{1.996\times10^{-13}}=4.47\times10^{-7}\,\text{m}=0.447\,\mu\text{m}. (1)

(b) Charge neutrality: NAxp=NDxnN_A x_p = N_D x_n, so xnW=NANA+ND=2×10172.05×1017=0.976\dfrac{x_n}{W}=\dfrac{N_A}{N_A+N_D}=\dfrac{2\times10^{17}}{2.05\times10^{17}}=0.976. (2) The depletion region extends mostly into the lightly-doped n-side because fewer dopant atoms per volume there require a wider region to expose equal charge. (1)

(c) Cj=εSiA/WC_j = \varepsilon_{Si}A/W. A=104cm2=108m2A=10^{-4}\,\text{cm}^2=10^{-8}\,\text{m}^2. (1) Cj=1.036×1010×1084.47×107=2.32×1012F=2.32pFC_j=\dfrac{1.036\times10^{-10}\times10^{-8}}{4.47\times10^{-7}}=2.32\times10^{-12}\,\text{F}=2.32\,\text{pF}. (2)

(d) WVbi+VRW\propto\sqrt{V_{bi}+V_R}, so W5=W0(0.753+5)/0.753=W07.64=2.76W0=1.24μmW_5=W_0\sqrt{(0.753+5)/0.753}=W_0\sqrt{7.64}=2.76\,W_0=1.24\,\mu\text{m}. (1) C5=C0/2.76=0.84pFC_5=C_0/2.76=0.84\,\text{pF}; ratio C5/C0=1/2.76=0.362C_5/C_0=1/2.76=0.362. (2) As reverse voltage increases the depletion width grows, reducing capacitance; thus CC is controlled by applied voltage (varactor behaviour). (1)


Question 3

(a) I=IS(eV/nVT1)I=I_S\big(e^{V/nV_T}-1\big). V/VT=0.60/0.02585=23.21V/V_T=0.60/0.02585=23.21. (1) e23.21=1.20×1010e^{23.21}=1.20\times10^{10}. (1) I=2×1014×1.20×1010=2.4×104A0.24mAI=2\times10^{-14}\times1.20\times10^{10}=2.4\times10^{-4}\,\text{A}\approx0.24\,\text{mA}. (1)

(b) For ×10\times10: ΔV=nVTln10=0.02585×2.303=0.0595V59.5mV\Delta V=nV_T\ln10=0.02585\times2.303=0.0595\,\text{V}\approx59.5\,\text{mV}. (3)

(c) At V=2VV=-2\,\text{V}: e2/0.02585=e77.40e^{-2/0.02585}=e^{-77.4}\approx0, so IIS=2×1014AI\approx-I_S=-2\times10^{-14}\,\text{A}. (2) Real diodes show much larger reverse current due to generation in the depletion region and surface leakage. (1)

(d) 118mV=nVTln10n=0.1180.0595=1.982118\,\text{mV}=nV_T\ln10 \Rightarrow n=\dfrac{0.118}{0.0595}=1.98\approx2. (2) n>1n>1 arises from carrier recombination-generation within the depletion region (recombination current). (1)

(e) The Shockley equation assumes no breakdown; it does not model avalanche multiplication / Zener tunnelling, which cause the large reverse current at breakdown. (2)


Question 4

(a) Diode A (4.3 V, low breakdown voltage) → Zener: high doping ⇒ thin depletion region ⇒ very high field ⇒ direct band-to-band tunnelling. Diode B (12 V) → avalanche: lighter doping, wider depletion region, carriers gain enough energy for impact ionisation. (Crossover ~5–6 V in silicon.) (4)

(b) Zener (Diode A): negative temperature coefficient — higher T reduces band gap, making tunnelling easier so breakdown voltage falls. (1.5) Avalanche (Diode B): positive coefficient — higher T increases phonon scattering, shortening carrier mean free path, so a higher field/voltage is needed for ionisation. (1.5)

(c) Combining a negative-TC Zener diode in series with a positive-TC avalanche diode (or using a ~5.6 V device where both mechanisms coexist) lets the two temperature coefficients cancel, giving a near-zero net TC voltage reference. (3)


Question 5

(a) ISni2T3eEg/kTI_S\propto n_i^2\propto T^3 e^{-E_g/kT}. IS(350)IS(300)=(350300)3exp ⁣[Egk(13501300)]\dfrac{I_S(350)}{I_S(300)}=\left(\dfrac{350}{300}\right)^3 \exp\!\Big[-\dfrac{E_g}{k}\big(\tfrac1{350}-\tfrac1{300}\big)\Big]. (1) (350/300)3=1.588(350/300)^3=1.588. (1) Eg/k=1.12×1.602×1019/1.381×1023=1.299×104KE_g/k=1.12\times1.602\times10^{-19}/1.381\times10^{-23}=1.299\times10^4\,\text{K}. 13001350=4.762×104\tfrac1{300}-\tfrac1{350}=4.762\times10^{-4}; product =1.299×104×4.762×104=6.186=1.299\times10^4\times4.762\times10^{-4}=6.186. (1) e6.186=486.5e^{6.186}=486.5. (1) Ratio =1.588×486.5=772.6=1.588\times486.5=772.6; IS(350)7.7×1011AI_S(350)\approx7.7\times10^{-11}\,\text{A}. (1)

(b) Over 50 K the current rose ~773×; per 10 K factor =7731/5=3.76=773^{1/5}=3.76. (2) This is somewhat above but consistent in spirit with the common "leakage roughly doubles per ~10 °C" engineering rule. (1)

(c) IS1/NAI_S\propto1/N_A (p-side term), so tenfold NAN_A reduces ISI_S by ~10×; at fixed forward current VF=nVTln(I/IS)V_F=nV_T\ln(I/I_S) increases by VTln1060mVV_T\ln10\approx60\,\text{mV}. (2)


[
  {"claim":"Vbi = 0.753 V for given doping","code":"VT=0.02585; NA=2e17; ND=5e15; ni=1.5e10; Vbi=VT*log(NA*ND/ni**2); result = abs(float(Vbi)-0.753)<0.005"},
  {"claim":"Delta Vbi for 100x ND is ~119 mV","code":"VT=0.02585; d=VT*log(100); result = abs(float(d)-0.119)<0.002"},
  {"claim":"Depletion width ~0.447 um","code":"eps=11.7*8.854e-12; q=1.602e-19; NA=2e23; ND=5e21; Vbi=0.753; W=sqrt(2*eps/q*(1/NA+1/ND)*Vbi); result = abs(float(W)-4.47e-7)<0.1e-7"},
  {"claim":"n-side fraction of W is ~0.976","code":"NA=2e17; ND=5e15; f=NA/(NA+ND); result = abs(float(f)-0.976)<0.002"},
  {"claim":"Forward current at 0.6V ~0.24 mA","code":"IS=2e-14; VT=0.02585; I=IS*(exp(0.6/VT)-1); result = abs(float(I)-2.4e-4)<0.3e-4"},
  {"claim":"Decade voltage step ~59.5 mV for n=1","code":"VT=0.02585; dV=VT*log(10); result = abs(float(dV)-0.0595)<0.001"},
  {"claim":"Effective n from 118mV decade is ~2","code":"VT=0.02585; n=0.118/(VT*log(10)); result = abs(float(n)-1.98)<0.05"},
  {"claim":"IS ratio 300->350K is ~773","code":"k=1.381e-23; q=1.602e-19; Eg=1.12*q; r=(350/300)**3*exp(-Eg/k*(1/350-1/300)); result = abs(float(r)-772.6)<10"},
  {"claim":"Per-10K factor ~3.76","code":"f=772.6**(1/5); result = abs(float(f)-3.76)<0.05"}
]