Exercises — Thermal analysis — conduction in structures, thermal stress
3.6.14 · D4· Physics › Spacecraft Structures & Systems Engineering › Thermal analysis — conduction in structures, thermal stress
Yeh ek self-testing page hai. Har problem ka ek clean statement diya gaya hai; worked solution ek collapsible callout mein chhupa hua hai — pehle khud try karo, phir reveal karo. Problems L1 Recognition (sahi formula dhundho) se lekar L5 Mastery (design-level synthesis) tak climb karti hain.
Yahan sab kuch parent note par build karta hai. Shuru karne se pehle, make sure karo ki tumhare paas woh chaar tools hain jo usne build kiye the:
Recall Chaar formulas jo tum use karoge
Fourier's law (1D): — heat flux, conductivity ka temperature graph ki steepness ke saath product hai, minus sign ke saath kyunki heat downhill hot se cold ki taraf jaati hai. Linear temperature profile: — dono end temperatures ke beech ek seedhi line. Thermal stress, full constraint: — woh stress jo ek rod feel karti hai jab woh se expand karna chahti hai lekin use allow nahi kiya jaata. Free expansion: — ek free rod har degree mein kitni length gain karti hai.
Symbols: = thermal conductivity (W/m·K), = Young's modulus (Pa, "stiffness"), = coefficient of thermal expansion (per K, "heat ke saath kitna badhne ka mann karta hai"), = temperature change (K), = length (m), = cross-section area (m²).
Ek quick sign compass haath mein rakho:

Kisi bhi flux problem se pehle, is sketch ke saath coordinate convention fix karo:

Level 1 — Recognition
L1·Q1 — Flux sign padho
Ek rod mein hai par aur hai par. ya ke liye kisi bhi number ke bina, heat kis direction mein flow karti hai, aur kya flux positive hai ya negative (jahan end 1 se end 2 ki taraf point karta hai)?
Recall Solution
Heat hamesha hot se cold ki taraf flow karti hai. Hot end par hai, cold end par hai, isliye heat direction mein flow karti hai → flux positive hai (figure s03 se compare karo). Formula se check karo: ka graph badhne ke saath girta hai, isliye . Tab . ✓
L1·Q2 — Formula chuno
Tumhe bataya gaya hai ki ek strut dono ends par rigidly bolted hai aur uniformly heat ki ja rahi hai. Tumhe stress find karna hai. Kaun sa single formula apply hota hai, aur answer ka sign tumhe kya batata hai?
Recall Solution
Dono ends fixed + uniform heating = full constraint, isliye use karo. Uniform heating ka matlab hai, isliye → compression. Rod ko squeeze kiya ja raha hai kyunki woh expand nahi kar sakti (figure s01 ka left panel).
Level 2 — Application
L2·Q1 — Midpoint temperature
Ek copper bracket ki length m hai, aur hai. m par temperature find karo.
Recall Solution
Linear profile use karo. Slope . . Yeh kaisa dikhta hai: ek seedhi line jo steadily girte jaati hai; quarter raste par jaane ke baad humne total swing ka ek quarter drop kiya hai.
L2·Q2 — Heat flux magnitude
Wohi copper bracket ( W/m·K, m, , , cross-section m²). Heat flux aur total heat power find karo jo usme flow ho rahi hai.
Recall Solution
Fourier's law se shuru karo aur ek ek piece build karo taaki koi step chhupe nahi. Step 1 — temperature difference. K. Negative kyun? End 2, end 1 se thanda hai, isliye mein jaate waqt temperature K drop karti hai. Step 2 — slope (gradient). K/m. Kyun? Us K drop ko length ke m par spread karo; har metre K drop karta, aur sign negative rehta kyunki temperature ke saath girti hai. Step 3 — se multiply karo. . Do minus signs kyun? Fourier's downhill rule hai (heat gradient ke neeche run karti hai); falling slope hai. Ek negative ka negative positive hota hai: . Toh . Positive → heat mein flow karti hai (hot se cold), figure s03 se match karta hai. ✓ Step 4 — total power. . Area se multiply kyun? Flux power per square metre hai; cross-section se multiply karne par actual watts milti hain jo poori rod se pass ho rahi hain.
L2·Q3 — Free expansion length
Ek steel rail-jaisi fitting, m, /K, se tak warm hoti hai jabki dono ends par free hai. Yeh kitni lambi ho jaati hai, aur stress kya hai?
Recall Solution
K. m mm. Kyunki woh free hai, kuch bhi growth resist nahi karta → . Displacement hai, stress nahi.
Level 3 — Analysis
L3·Q1 — Gradient ke dono ends par stress
Ek aluminum beam ( GPa, /K), fully constrained, se tak linear profile carry karti hai. Reference temperature (stress-free assembly temperature) use karte hue, aur find karo.

Recall Solution
Constrained slice ke liye local stress: . Hot end : K. MPa → compression (hot end grow karna chahta hai, squeeze kiya ja raha hai). Cold end : K. MPa → tension (cold end shrink karna chahta hai, stretch kiya ja raha hai). Yeh kaisa dikhta hai (figure s02): stress ek seedhi line hai jo exactly wahan zero cross karti hai jahan hai, yani yahan midpoint par.
L3·Q2 — Stress zero kahan hai?
L3·Q1 ki beam ke liye, kis position (aur temperature) par thermal stress exactly zero hai?
Recall Solution
ke liye chahiye. Profile: . Set : . Neutral point midpoint par baitha hai, aadhe raste mein, kyunki exactly aur ke beech mein hai. Ek taraf material compressed hai, doosri taraf stretched hai (figure s02 mein red dot).
L3·Q3 — Kaun sa end zyada dangerous hai?
Ek material tension mein MPa par fail hoti hai lekin MPa compression tolerate karti hai (ek common ceramic-jaisi asymmetry). L3·Q1 ke stresses use karte hue, kaun sa end failure ke zyada close hai, aur safety margin kya hai?
Recall Solution
Compression end: MPa, MPa limit ke against → margin . Tension end: MPa, MPa limit ke against → margin . Cold (tension) end kaafi zyada dangerous hai: uska margin sirf hai ke against. Brittle spacecraft materials cold end par tensile thermal stress se crack karti hain, hot end par nahi — pehli intuition ke ulta.
Level 4 — Synthesis
L4·Q1 — Fatigue cycle count
Ek titanium strut ( GPa, /K), fully constrained, har -minute orbit mein ek baar aur ke beech cycle karti hai. Find karo (a) stress range , aur (b) ek -year mission mein cycles ki sankhya.
Recall Solution
(a) Stress range peak-to-peak swing hai, isliye woh sirf temperature swing par depend karta hai: K. MPa. (Yeh most-compressive se most-tensile tak swing ki magnitude hai; upar ki definition ke anusaar, ek range ek positive distance hai, isliye ka minus sign drop ho jaata hai.) (b) Cycles per day: . Per year: . Ten years: cycles. Yeh ek real fatigue driver hai — dekho Fatigue and Fracture Mechanics.
L4·Q2 — Stress reduction ke liye material trade
L4·Q1 ki strut MPa range experience karti hai. Ek designer titanium ki jagah ek CFRP tube swap karta hai jisme /K aur GPa hai. New stress range kya hai, aur yeh kitne factor se drop hua?
Recall Solution
MPa. Reduction factor . Chahe CFRP stiffer hai (higher ), uska near-zero product ko dominate karta hai. Isi liye Composite Materials in Spacecraft aur sochhe-samjhe Material Selection for Spacecraft thermal-stress ki ladaai jeet jaate hain — tum factor par attack karte ho, factor par nahi.
L4·Q3 — Partial constraint (fixed–spring)
Ek rod (, , area , length ) par fixed hai lekin par rigid wall ki jagah stiffness (N/m) ki ek soft spring se hold ki gayi hai. Uniform heating par, free expansion ka sirf ek hissa allow hota hai. Dikhao ki rod force yeh hai: aur do limits aur check karo.
Recall Solution
Maan lo far end actually baahaar move karta hai (free se kam). Rod blocked amount se compress hoti hai, jo ek compressive force produce karti hai: Wohi force spring ko baahaar push karta hai, isliye . Substitute karo: collect karo: , se milta hai: Limit (rigid wall): denominator , isliye , yaani stress — full-constraint result. ✓ Limit (free end): denominator , isliye — ek free rod koi stress carry nahi karti. ✓ Soft spring smoothly dono textbook cases ke beech interpolate karta hai — yahi real spacecraft situation hai, jahan mounts stiff hote hain lekin kabhi perfectly rigid nahi hote.
Level 5 — Mastery
L5·Q1 — Full design decision
Ek optical bench truss length m ke struts use karta hai, fully constrained, ek orbital swing K par. Requirement: -cycle fatigue life ke liye stress range MPa. Teen candidate materials:
| Material | (GPa) | (/K) |
|---|---|---|
| Aluminum 6061 | 69 | 23.6 |
| Titanium 6Al-4V | 114 | 8.6 |
| CFRP (quasi-iso) | 70 | 2.0 |
(a) Har ek ke liye compute karo. (b) Kaun se MPa gate pass karte hain? (c) Jo fail karte hain unke liye, MPa gate ke under laane ke liye L4·Q3 se kaun sa compliance factor chahiye hoga?
Recall Solution
(a) use karte hue K ke saath:
- Aluminum: MPa.
- Titanium: MPa.
- CFRP: MPa. (b) Gate MPa hai. Sirf CFRP pass karta hai (). Aluminum aur titanium fail karte hain. (c) Compliance, constraint stress ko se multiply karta hai (L4·Q3 se, ). Humein chahiye:
- Aluminum: — mount sirf rigid-constraint force ka pass kare (bahut soft mounts).
- Titanium: — mount sirf pass kare. Design call: CFRP gate bina kisi special mounting ke meet karta hai, isliye yeh lowest-risk choice hai: koi floppy flexures design nahi karne, koi positional-stiffness penalty nahi, aur margin bhi bacha ( vs MPa). Aluminum aur titanium dono ko deliberately compliant mounts (flexures / thermal isolators) chahiye hote un values ke size ke, jo mass aur complexity add karte jabki pointing stiffness erode karte. Yeh precision structures mein low- Composite Materials in Spacecraft ki textbook win hai; dekho Deployable Structures bhi jahan isi stress se thermal snap-through ek failure mode hai.
L5·Q2 — Coupled conduction + stress budget
Ek aluminum strut ( W/m·K, GPa, /K, m, m²) ek fitting aur ek radiator ko bridge karta hai, fully constrained, par stress-free. Find karo (a) conducted heat power, (b) cold end par tensile stress, aur (c) kya yeh ek MPa tensile allowable mein survive karta hai.
Recall Solution
(a) Flux . Power W hot→cold flow kar rahi hai. (b) Cold-end stress: MPa (tension). (c) MPa MPa allowable → yeh fail karta hai cold end par. Conduction theek hai ( W easily radiated hai), lekin frigid end par tensile thermal stress limit exceed kar raha hai. Remedy: low- material swap karo, compliance add karo, ya fitting ko Thermal Control Subsystems ke zariye thermally isolate karo effective shrink karne ke liye.
Recall Self-test recall
Hot-at-x=0, cold-at-x=L ke liye heat flow ki direction, jab +x 0 se L tak ho ::: +x direction, flux positive. Ek held, uniformly heated rod mein thermal stress ka sign ::: negative (compression). Linear gradient mein thermal stress kahan zero hai ::: jahan stress-free reference ke barabar ho. Kaun sa product shrink karna hai thermal stress cut karne ke liye, aur kaun sa factor usually dominate karta hai ::: shrink karo; (expansion) factor usually choice dominate karta hai. par fixed–spring formula se full-constraint stress ::: . hone par thermal stress ka kya hota hai ::: bilkul khatam ho jaata hai; koi temperature change nahi matlab koi thermal loading nahi. Jab mounts perfectly compliant ho jaate hain () toh fatigue stress range ka kya hota hai ::: range ; ek floppy mount koi cyclic force transmit nahi karta.