5.4.10Materials Chemistry (Aerospace)

Surface treatments — anodising, plasma spraying, vapour deposition

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1. Anodising — growing a protective oxide on aluminium

WHY do we do it? Bare aluminium already self-passivates with ~2–3 nm of oxide, but that is too thin to resist wear/corrosion. Anodising grows it to 5–25 µm, hard and porous (so it can be dyed and then sealed).

HOW — derive the thickness from charge. The oxidation half-reaction is 2Al+3H2OAl2O3+6H++6e2\mathrm{Al} + 3\mathrm{H_2O} \rightarrow \mathrm{Al_2O_3} + 6H^+ + 6e^-

So 6 electrons liberate 1 mole of Al2O3\mathrm{Al_2O_3}. From Faraday's law the moles of oxide formed by charge Q=ItQ=It: noxide=Q6Fηn_{\text{oxide}} = \frac{Q}{6F} \cdot \eta where F=96485C/molF=96485\,\mathrm{C/mol} and η\eta is current efficiency (fraction of charge actually building oxide). Converting to thickness dd over area AA: d=MQη6FρA\boxed{d = \frac{M\,Q\,\eta}{6F\,\rho\,A}}


2. Plasma spraying — building a thick coat from molten droplets

WHY: to deposit refractory ceramics like ZrO2\mathrm{ZrO_2} that melt at ~2700 °C — no electrolyte or vapour route is practical for thick (100–500 µm) heat-shield layers.

HOW — the energy a particle must absorb. To melt a particle of mass mm from T0T_0 to its melting point TmT_m then fuse it: Qmelt=mcp(TmT0)+mLfQ_{\text{melt}} = m\,c_p (T_m - T_0) + m\,L_f

  • Why two terms? First raise temperature (cpΔTc_p\Delta T), then supply latent heat of fusion LfL_f at constant TT to actually melt.

A particle survives only if plasma residence time gives it this energy faster than it cools — the basis of spray-parameter optimisation.


3. Vapour deposition — atom-by-atom thin films

WHY: for thin (0.5–10 µm), extremely hard, smooth films (wear, oxidation, diffusion barriers). The key contrast: PVD = physical change only; CVD = a chemical reaction at the surface.

HOW — deposition rate from flux. The arriving mass flux gives growth rate rr: r=ΦMNAρr = \frac{\Phi M}{N_A \rho} where Φ\Phi = atoms hitting per m² per s, MM = molar mass, ρ\rho = film density.

  • Why divide by NAρN_A\rho? ΦM/NA\Phi M/N_A is mass per area per second; dividing by density turns mass-per-area into thickness per second.
Figure — Surface treatments — anodising, plasma spraying, vapour deposition

Recall Feynman: explain to a 12-year-old

Imagine your metal plane part is like a sandwich. The bread (surface) gets stale and mouldy first, not the filling. Anodising = letting the bread grow its own tough crust by zapping it in acid. Plasma spraying = a super-hot spray gun that throws tiny melted ceramic "snowballs" that splat and stack into a heat-blanket. Vapour deposition = painting with single atoms from a cloud — a paint so thin it’s invisible but harder than the metal. All three armour the skin, not the whole sandwich, to stay light.

Connections

  • Corrosion and Passivation — anodising is engineered passivation
  • Thermal Barrier Coatings — plasma-sprayed YSZ on turbine blades
  • Faraday's Laws of Electrolysis — quantifies anodised thickness
  • Adhesion and Surface Roughness — grit-blasting before spraying
  • Aluminium Alloys in Aerospace — the substrate being protected
  • Latent Heat and Phase Change — melting droplets in plasma

Anodising makes the workpiece the
anode (it is oxidised to grow oxide)
Oxidation half-reaction in Al anodising
2Al+3H2OAl2O3+6H++6e2Al + 3H_2O \rightarrow Al_2O_3 + 6H^+ + 6e^-
Electrons needed per mole of Al2O3Al_2O_3 in anodising
6
Formula for anodised oxide thickness
d=MItη/(6FρA)d = M I t \eta /(6 F \rho A)
Typical anodised oxide thickness range
~5–25 µm
Why anodised oxide can be dyed
it is porous before sealing
Plasma spray jet temperature
~10,000–15,000 K
Energy to melt a spray particle
Q=mcp(TmT0)+mLfQ = m c_p (T_m-T_0) + m L_f
Why two terms in melting energy
heating (cpΔTc_p\Delta T) then latent heat of fusion LfL_f
Main bonding mechanism in plasma spraying
mechanical interlocking on roughened surface
One-word difference PVD vs CVD
chemical reaction (CVD reacts, PVD is physical)
Balanced CVD reaction for TiN
TiCl4+12N2+2H2TiN+4HClTiCl_4 + \tfrac{1}{2}N_2 + 2H_2 \rightarrow TiN + 4HCl
PVD/CVD film thickness range
~0.5–10 µm (thin)
Vapour deposition growth rate formula
r=ΦM/(NAρ)r = \Phi M /(N_A \rho)
Which surface treatment gives thickest coat
plasma spraying (100–500 µm)
Which gives thinnest coat
vapour deposition (sub-µm to few µm)

Concept Map

motivates

method 1

method 2

method 3

is

part is

grows integral

via

gives

uses

melts powder into

forms

Surface fails first

Surface treatments

Anodising

Plasma spraying

Vapour deposition

Electrolytic oxidation

Anode in acid bath

Al2O3 layer 5-25 um

Faraday's law

Thickness d = M I t eta / 6F rho A

Plasma jet 10000-15000 K

Molten splats solidify

Thick ceramic coat e.g. YSZ

Hinglish (regional understanding)

Intuition Hinglish mein samjho

Dekho, aerospace mein part andar se strong ho sakta hai par problems hamesha surface se shuru hoti hain — corrosion, wear aur heat sab skin pe attack karte hain. Isiliye hum surface ko alag se engineer karte hain. Teen main methods hain.

Anodising: aluminium ko acid bath mein daalke uspe current chalate hain, aur part ko anode banate hain (yaad rakho — anode pe oxidation hoti hai). Isse natural oxide layer thick ho jaati hai, 5-25 micron tak, jo metal se hi grow hoti hai. Thickness Faraday's law se nikalti hai: jitna charge (ItIt), utna oxide. Common galti — log sochte hain part cathode hai, par nahi, oxide grow karne ke liye oxidation chahiye, isliye anode.

Plasma spraying: ek super-hot plasma gun (~12000 K) powder ko melt karke part pe maarti hai, jahan droplets "splat" hoke thick coating banate hain — jaise turbine blade pe zirconia heat-shield. Particle ko melt karne ki energy do part mein hoti hai: pehle temperature badhao (cpΔTc_p \Delta T), phir latent heat (LfL_f) de ke actually melt karo. Bonding mostly mechanical interlocking hai, weld nahi — isiliye surface ko grit-blast karke rough banana zaroori hai.

Vapour deposition: yahan film atom-by-atom banti hai gas phase se. PVD mein sirf physical change (evaporate/sputter), CVD mein chemical reaction surface pe (jaise TiCl4TiCl_4 se TiN, balanced: TiCl4+12N2+2H2TiN+4HClTiCl_4 + \tfrac12 N_2 + 2H_2 \to TiN + 4HCl). Ye films bahut patli (sub-micron se kuch micron) par extremely hard hoti hain. Growth rate slow hota hai (r=ΦM/NAρr=\Phi M/N_A\rho), isiliye sirf thin coats ke liye use hota hai. Easy memory: thick to thin = Plasma > Anodise > Vapour.

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Connections