WHY do we do it? Bare aluminium already self-passivates with ~2–3 nm of oxide, but that is too thin to resist wear/corrosion. Anodising grows it to 5–25 µm, hard and porous (so it can be dyed and then sealed).
HOW — derive the thickness from charge.
The oxidation half-reaction is
2Al+3H2O→Al2O3+6H++6e−
So 6 electrons liberate 1 mole of Al2O3. From Faraday's law the moles of oxide formed by charge Q=It:
noxide=6FQ⋅η
where F=96485C/mol and η is current efficiency (fraction of charge actually building oxide). Converting to thickness d over area A:
d=6FρAMQη
WHY: to deposit refractory ceramics like ZrO2 that melt at ~2700 °C — no electrolyte or vapour route is practical for thick (100–500 µm) heat-shield layers.
HOW — the energy a particle must absorb. To melt a particle of mass m from T0 to its melting point Tm then fuse it:
Qmelt=mcp(Tm−T0)+mLf
Why two terms? First raise temperature (cpΔT), then supply latent heat of fusionLf at constant T to actually melt.
A particle survives only if plasma residence time gives it this energy faster than it cools — the basis of spray-parameter optimisation.
WHY: for thin (0.5–10 µm), extremely hard, smooth films (wear, oxidation, diffusion barriers). The key contrast: PVD = physical change only; CVD = a chemical reaction at the surface.
HOW — deposition rate from flux. The arriving mass flux gives growth rate r:
r=NAρΦM
where Φ = atoms hitting per m² per s, M = molar mass, ρ = film density.
Why divide by NAρ?ΦM/NA is mass per area per second; dividing by density turns mass-per-area into thickness per second.
Recall Feynman: explain to a 12-year-old
Imagine your metal plane part is like a sandwich. The bread (surface) gets stale and mouldy first, not the filling. Anodising = letting the bread grow its own tough crust by zapping it in acid. Plasma spraying = a super-hot spray gun that throws tiny melted ceramic "snowballs" that splat and stack into a heat-blanket. Vapour deposition = painting with single atoms from a cloud — a paint so thin it’s invisible but harder than the metal. All three armour the skin, not the whole sandwich, to stay light.
Dekho, aerospace mein part andar se strong ho sakta hai par problems hamesha surface se shuru hoti hain — corrosion, wear aur heat sab skin pe attack karte hain. Isiliye hum surface ko alag se engineer karte hain. Teen main methods hain.
Anodising: aluminium ko acid bath mein daalke uspe current chalate hain, aur part ko anode banate hain (yaad rakho — anode pe oxidation hoti hai). Isse natural oxide layer thick ho jaati hai, 5-25 micron tak, jo metal se hi grow hoti hai. Thickness Faraday's law se nikalti hai: jitna charge (It), utna oxide. Common galti — log sochte hain part cathode hai, par nahi, oxide grow karne ke liye oxidation chahiye, isliye anode.
Plasma spraying: ek super-hot plasma gun (~12000 K) powder ko melt karke part pe maarti hai, jahan droplets "splat" hoke thick coating banate hain — jaise turbine blade pe zirconia heat-shield. Particle ko melt karne ki energy do part mein hoti hai: pehle temperature badhao (cpΔT), phir latent heat (Lf) de ke actually melt karo. Bonding mostly mechanical interlocking hai, weld nahi — isiliye surface ko grit-blast karke rough banana zaroori hai.
Vapour deposition: yahan film atom-by-atom banti hai gas phase se. PVD mein sirf physical change (evaporate/sputter), CVD mein chemical reaction surface pe (jaise TiCl4 se TiN, balanced: TiCl4+21N2+2H2→TiN+4HCl). Ye films bahut patli (sub-micron se kuch micron) par extremely hard hoti hain. Growth rate slow hota hai (r=ΦM/NAρ), isiliye sirf thin coats ke liye use hota hai. Easy memory: thick to thin = Plasma > Anodise > Vapour.